Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods

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Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods

The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples were prepared with 25 different designs with 5 different bonding parameters such as time, ultrasonic power, begin- force, end-force and touch-down steps (pre-compression) with 5 levels. The bond signal...

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Bibliographic Details
Main Authors:	Arjmand, E., Agyakwa, P.A., Johnson, C.M.
Format:	Article
Published:	Elsevier 2014
Subjects:	Wire bonding process parameters non-destructive methodology reliability x-ray tomography passive thermal cycling power electronic modules
Online Access:	https://eprints.nottingham.ac.uk/36483/

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