Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs

This work aims to present an investigation on short-circuit (SC) failure behaviour of SiC Power MOSFETs due to the onset of thermal runaway. As inferable from experimental outcomes, it is related to the formation of hotspot, whose exact location is mainly unpredictable and dictated by device structu...

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Main Authors: Romano, Gianpaolo, Riccio, Michele, Maresca, Luca, Fayyaz, Asad, Castellazzi, Alberto
Format: Conference or Workshop Item
Published: 2016
Subjects:
Online Access:https://eprints.nottingham.ac.uk/36365/
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author Romano, Gianpaolo
Riccio, Michele
Maresca, Luca
Fayyaz, Asad
Castellazzi, Alberto
author_facet Romano, Gianpaolo
Riccio, Michele
Maresca, Luca
Fayyaz, Asad
Castellazzi, Alberto
author_sort Romano, Gianpaolo
building Nottingham Research Data Repository
collection Online Access
description This work aims to present an investigation on short-circuit (SC) failure behaviour of SiC Power MOSFETs due to the onset of thermal runaway. As inferable from experimental outcomes, it is related to the formation of hotspot, whose exact location is mainly unpredictable and dictated by device structure and design parameters non-uniformities. TCAD simulations were performed to examine the impact of some parameters mismatch on hotspot formation and failure occurrence
first_indexed 2025-11-14T19:29:28Z
format Conference or Workshop Item
id nottingham-36365
institution University of Nottingham Malaysia Campus
institution_category Local University
last_indexed 2025-11-14T19:29:28Z
publishDate 2016
recordtype eprints
repository_type Digital Repository
spelling nottingham-363652020-05-04T17:59:22Z https://eprints.nottingham.ac.uk/36365/ Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs Romano, Gianpaolo Riccio, Michele Maresca, Luca Fayyaz, Asad Castellazzi, Alberto This work aims to present an investigation on short-circuit (SC) failure behaviour of SiC Power MOSFETs due to the onset of thermal runaway. As inferable from experimental outcomes, it is related to the formation of hotspot, whose exact location is mainly unpredictable and dictated by device structure and design parameters non-uniformities. TCAD simulations were performed to examine the impact of some parameters mismatch on hotspot formation and failure occurrence 2016-07-28 Conference or Workshop Item PeerReviewed Romano, Gianpaolo, Riccio, Michele, Maresca, Luca, Fayyaz, Asad and Castellazzi, Alberto (2016) Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs. In: 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 12-16 Jun 2016, Prague, Czech Republic. Silicon Carbide (SiC) Power MOSFET; Short-circuit failure; Short-Circuit ruggedness; Thermal Runaway; hot-spot; TCAD 2D simulation http://ieeexplore.ieee.org/document/7520774/?arnumber=7520774
spellingShingle Silicon Carbide (SiC) Power MOSFET; Short-circuit failure; Short-Circuit ruggedness; Thermal Runaway; hot-spot; TCAD 2D simulation
Romano, Gianpaolo
Riccio, Michele
Maresca, Luca
Fayyaz, Asad
Castellazzi, Alberto
Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs
title Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs
title_full Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs
title_fullStr Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs
title_full_unstemmed Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs
title_short Influence of design parameters on the short-circuit ruggedness of SiC Power MOSFETs
title_sort influence of design parameters on the short-circuit ruggedness of sic power mosfets
topic Silicon Carbide (SiC) Power MOSFET; Short-circuit failure; Short-Circuit ruggedness; Thermal Runaway; hot-spot; TCAD 2D simulation
url https://eprints.nottingham.ac.uk/36365/
https://eprints.nottingham.ac.uk/36365/