The interplay of crack hopping, delamination and interface failure in drying nanoparticle films

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The interplay of crack hopping, delamination and interface failure in drying nanoparticle films

Films formed through the drying of nanoparticle suspensions release the build-up of strain through a variety of different mechanisms including shear banding, crack formation and delamination. Here we show that important connections exist between these different phenomena: delamination depends on the...

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Bibliographic Details
Main Authors:	Yang, Bin, Sharp, James S., Smith, Mike I.
Format:	Article
Published:	Nature Publishing Group 2016
Online Access:	https://eprints.nottingham.ac.uk/35732/

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