Selection of materials for IGBT modules to achieve stable short circuit failure behaviour

QR Code

Selection of materials for IGBT modules to achieve stable short circuit failure behaviour

IGBT modules which can fail to stable short circuit mode have great allocations in electricity network related fields. Sn3.5Ag solder joint and sintered Ag joint for the die attachment and Mo, Cu, Sn3.5Ag, Al and Ag foils for the top side insert material in the press pack like single IGBT samples ha...

Full description

Bibliographic Details
Main Authors:	Li, Jianfeng, Yaqub, Imran, Johnson, Christopher Mark
Format:	Conference or Workshop Item
Published:	2016
Online Access:	https://eprints.nottingham.ac.uk/35676/

Similar Items

Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior
by: Li, Jianfeng, et al.
Published: (2017)

Investigation into stable failure to short circuit in IGBT power modules
by: Yaqub, Imran
Published: (2015)

Dependence of overcurrent failure modes of IGBT modules on interconnect technologies
by: Yaqub, Imran, et al.
Published: (2015)

Application of Kalman filter to estimate junction temperature in IGBT power modules
by: Eleffendi, Mohd. Amir, et al.
Published: (2015)

Application of STATCOM-HTS to Improve DFIG Performance and FRT during IGBT Short Circuit
by: Abdou, A., et al.
Published: (2014)

Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules
by: Yang, Li, et al.
Published: (2018)

Reliable integration of a high performance multi-chip half-bridge SiC power module
by: Mouawad, Bassem, et al.
Published: (2016)

Overload robust IGBT design for SSCB application
by: Supono, I., et al.
Published: (2014)

Novel silicon carbide integrated power module for EV application
by: Mouawad, Bassem, et al.
Published: (2018)

Material Properties - Short Circuit Current Correlations in Quantum Dot Solar Cell
by: Saifful Kamaluddin, Muzakir, et al.
Published: (2014)

Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules
by: Yang, Li, et al.
Published: (2013)

The failure of integrated circuit: test and analysis
by: Hassan, Hasliza
Published: (2019)

Exercise Training in Patients with Stable Chronic Heart Failure
by: Butterfield, J., et al.
Published: (2008)

Highly Stable External Short-Circuit-Assisted Oxygen Ionic Transport Membrane Reactor for Carbon Dioxide Reduction Coupled with Methane Partial Oxidation
by: Zhang, K, et al.
Published: (2014)

Highly stable external short-circuit-assisted oxygen ionic transport membrane reactor for carbon dioxide reduction coupled with methane partial oxidation
by: Zhang, Kun, et al.
Published: (2014)

IGBT-SiC dual fed ground power unit
by: Rovere, Luca, et al.
Published: (2017)

IGBT modelling using Hspice curve-fitting optimisation method
by: Norman Mariun,, et al.
Published: (2000)

Switching characteristic and analysis of insulated-gate bipolar transistor (IGBT)
by: Bakhtiar, Ahmad
Published: (2009)

IGBT modelling using HSPICE curve-fitting optimisation method
by: Mariun, Norman, et al.
Published: (2000)

UWB pulse generation and modulation circuits for biomedical implants
by: Mohammed, Mokhaled Mustafa, et al.
Published: (2011)

Co-design/simulation of flip-chip assembly for high voltage IGBT packages
by: Rajaguru, P., et al.
Published: (2017)

Short-circuit fault analysis and isolation strategy for matrix converters
by: Wang, Li-Na, et al.
Published: (2015)

A physical RC network model for electro-thermal analysis of a multichip SiC power module
by: Li, Jianfeng, et al.
Published: (2017)

Highly stable Delta-Sigma Modulator for industrial applications
by: Diwakar, K., et al.
Published: (2008)

Switching Converter with Highly Stable Delta-Sigma Modulator
by: K., Diwakar, et al.
Published: (2008)

Packaging/assembling technologies for a high performance SiC-based planar power module
by: Li, Jianfeng, et al.
Published: (2014)

IGBT-SiC dual fed open end winding PMSM drive
by: Rovere, Luca, et al.
Published: (2017)

Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment
by: Li, Jianfeng, et al.
Published: (2014)

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints
by: Li, Jianfeng, et al.
Published: (2018)

Investigating ageing behaviours in supercapacitor (cells and modules) using EEC (electrical equivalent circuit) models
by: Abubakar, Hadiza Ahmad
Published: (2017)

Achieving stable subspace clustering by post-processing generic clustering results
by: Pham, DucSon, et al.
Published: (2016)

Fatigue failures of differences behaviour on CSM/woven roving composite materials
by: T. Arifin, A.M., et al.
Published: (2014)

Experimental comparison of a matrix converter using Si IGBT and SiC MOSFETs
by: Trentin, Andrew, et al.
Published: (2015)

Determination of dynamic parameters for HSPICE IGBT model using curve-fitting optimisation method
by: Mariun, Norman, et al.
Published: (1998)

Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules
by: Musallam, Mahera, et al.
Published: (2014)

Reactive material jetting of polyimide insulators for complex circuit board design
by: Zhang, Fan, et al.
Published: (2019)

Open-Circuit Voltage Enhancement on the Basis of Polymer Gel Electrolyte for a Highly Stable Dye-Sensitized Solar Cell
by: Wu, Congcong, et al.
Published: (2013)

Preventing postnatal growth failure - the significance of feeding when the preterm infant is clinically stable
by: McLeod, G., et al.
Published: (2007)

Thermal energy storage behaviour of form-stable polyethylene glycol/MWCNT- based phase change materials
by: Yadav, Aman, et al.
Published: (2024)

Achieving Stable Throughput to Support QoS in IEEE 802.11 Wireless Networks
by: Md Khambari, M. N., et al.
Published: (2009)