Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultra...

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Bibliographic Details
Main Authors: Arjmand, Elahjeh, Agyakwa, Pearl, Corfield, Martin, Li, Jianfeng, Johnson, Christopher Mark
Format: Article
Published: IEEE 2016
Subjects:
Electronics packaging; Forecasting; Nanocomposites; Quality control; Ultrasonic applications; Ultrasonic equipment; Ultrasonic waves; Wire Classification methods; Non-destructive technique; Nondestructive tools; Quality classification; Real time evaluation; Semi-supervised classification; Temperature cycling; Ultrasonic generator Engineering main heading: Ultrasonic testing
Online Access:https://eprints.nottingham.ac.uk/33374/

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