Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator
Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultra...
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| Format: | Article |
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IEEE
2016
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| Online Access: | https://eprints.nottingham.ac.uk/33374/ |
| _version_ | 1848794616791302144 |
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| author | Arjmand, Elahjeh Agyakwa, Pearl Corfield, Martin Li, Jianfeng Johnson, Christopher Mark |
| author_facet | Arjmand, Elahjeh Agyakwa, Pearl Corfield, Martin Li, Jianfeng Johnson, Christopher Mark |
| author_sort | Arjmand, Elahjeh |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultrasonic generator. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area measured by X-ray tomography. Samples classified during bonding were subjected to temperature cycling between -55 °C and +125 °C, and the distribution of bond life amongst the different classes was analyzed. It is demonstrated that the as-bonded quality classification is closely correlated with thermal cycling life and can, therefore, be used as a nondestructive tool for monitoring bond quality and predicting useful service life. |
| first_indexed | 2025-11-14T19:19:02Z |
| format | Article |
| id | nottingham-33374 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T19:19:02Z |
| publishDate | 2016 |
| publisher | IEEE |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-333742020-05-04T20:02:37Z https://eprints.nottingham.ac.uk/33374/ Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator Arjmand, Elahjeh Agyakwa, Pearl Corfield, Martin Li, Jianfeng Johnson, Christopher Mark Routine monitoring of the wire bonding process requires real-time evaluation and control of wire bond quality. In this paper, we present a nondestructive technique for detecting bond quality by the application of a semisupervised classification algorithm to process the signals obtained from an ultrasonic generator. Experimental tests verified that the classification method is capable of accurately predicting bond quality, indicated by bonded area measured by X-ray tomography. Samples classified during bonding were subjected to temperature cycling between -55 °C and +125 °C, and the distribution of bond life amongst the different classes was analyzed. It is demonstrated that the as-bonded quality classification is closely correlated with thermal cycling life and can, therefore, be used as a nondestructive tool for monitoring bond quality and predicting useful service life. IEEE 2016-05 Article PeerReviewed Arjmand, Elahjeh, Agyakwa, Pearl, Corfield, Martin, Li, Jianfeng and Johnson, Christopher Mark (2016) Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator. IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (5). pp. 814-821. ISSN 2156-3985 Electronics packaging; Forecasting; Nanocomposites; Quality control; Ultrasonic applications; Ultrasonic equipment; Ultrasonic waves; Wire Classification methods; Non-destructive technique; Nondestructive tools; Quality classification; Real time evaluation; Semi-supervised classification; Temperature cycling; Ultrasonic generator Engineering main heading: Ultrasonic testing http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7450186 doi:10.1109/TCPMT.2016.2543001 doi:10.1109/TCPMT.2016.2543001 |
| spellingShingle | Electronics packaging; Forecasting; Nanocomposites; Quality control; Ultrasonic applications; Ultrasonic equipment; Ultrasonic waves; Wire Classification methods; Non-destructive technique; Nondestructive tools; Quality classification; Real time evaluation; Semi-supervised classification; Temperature cycling; Ultrasonic generator Engineering main heading: Ultrasonic testing Arjmand, Elahjeh Agyakwa, Pearl Corfield, Martin Li, Jianfeng Johnson, Christopher Mark Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator |
| title | Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator |
| title_full | Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator |
| title_fullStr | Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator |
| title_full_unstemmed | Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator |
| title_short | Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator |
| title_sort | predicting lifetime of thick al wire bonds using signals obtained from ultrasonic generator |
| topic | Electronics packaging; Forecasting; Nanocomposites; Quality control; Ultrasonic applications; Ultrasonic equipment; Ultrasonic waves; Wire Classification methods; Non-destructive technique; Nondestructive tools; Quality classification; Real time evaluation; Semi-supervised classification; Temperature cycling; Ultrasonic generator Engineering main heading: Ultrasonic testing |
| url | https://eprints.nottingham.ac.uk/33374/ https://eprints.nottingham.ac.uk/33374/ https://eprints.nottingham.ac.uk/33374/ |