Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects

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Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects

A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance. In this paper, special effort has been devoted to material selection and geometric shape of the bumps in the design for imp...

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Bibliographic Details
Main Authors:	Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa, Johnson, Christopher Mark
Format:	Article
Published:	Institute of Electrical and Electronics Engineers 2015
Subjects:	Cu/Mo/Cu composite finite-element (FE) method integration thermal cycling wirebond-less packaging
Online Access:	https://eprints.nottingham.ac.uk/30002/

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