I/O port macromodelling

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I/O port macromodelling

3D electromagnetic modelling and simulation of various Printed Circuit Board (PCB) components is an important technique for characterizing the Signal Integrity (SI) and Electromagnetic Compatibility (EMC) issues present in a PCB. However, due to limited computational resource and the complexity of t...

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Bibliographic Details
Main Author:	Kumar, Varindra
Format:	Thesis (University of Nottingham only)
Language:	English
Published:	2014
Subjects:	3D modelling Printed circuit board (PCB) Electromagnetic compatibility (EMC) Electromagnetic modelling Signal integrity (SI) Transmission line matrix modelling (TLM) S-parameter Macromodel Input output buffer Information specification (IBIS) PCB trace configurations Crosstalk
Online Access:	https://eprints.nottingham.ac.uk/14294/

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