Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints

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Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints

The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in s...

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Bibliographic Details
Main Author:	Leong, Kum Foo
Format:	Thesis
Published:	2003
Subjects:	QA Mathematics
Online Access:	http://shdl.mmu.edu.my/971/

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