Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints
The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in s...
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| Format: | Thesis |
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2003
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| Online Access: | http://shdl.mmu.edu.my/971/ |
| _version_ | 1848789672441937920 |
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| author | Leong, Kum Foo |
| author_facet | Leong, Kum Foo |
| author_sort | Leong, Kum Foo |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in some of the peripherals. In this project, the effect of repeated wave-soldering heating on the SMT mounted Sn/Pb eutectic solder joint on HASL (Hot Air Solder Leveling) PCB is investigated by measuring its three point bend strength. |
| first_indexed | 2025-11-14T18:00:26Z |
| format | Thesis |
| id | mmu-971 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:00:26Z |
| publishDate | 2003 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-9712010-07-15T06:31:45Z http://shdl.mmu.edu.my/971/ Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints Leong, Kum Foo QA Mathematics The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in some of the peripherals. In this project, the effect of repeated wave-soldering heating on the SMT mounted Sn/Pb eutectic solder joint on HASL (Hot Air Solder Leveling) PCB is investigated by measuring its three point bend strength. 2003-10 Thesis NonPeerReviewed Leong, Kum Foo (2003) Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints. Masters thesis, Multimedia University. http://myto.perpun.net.my/metoalogin/logina.php |
| spellingShingle | QA Mathematics Leong, Kum Foo Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints |
| title | Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints |
| title_full | Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints |
| title_fullStr | Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints |
| title_full_unstemmed | Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints |
| title_short | Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints |
| title_sort | ternary intermetallic formation and mechanical strength of wave soldered bga joints |
| topic | QA Mathematics |
| url | http://shdl.mmu.edu.my/971/ http://shdl.mmu.edu.my/971/ |