Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer

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Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer

Wafer thinning operation's parameters such as grit size, spindle speed, feed rate, tape material and the wafer handling mechanism are becoming very critical as the wafer becomes thinner. Temperature also plays a role in determining the amount of residual stresses on the wafers post thinning. T...

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Bibliographic Details
Main Author:	Cheong, Yew Wee
Format:	Thesis
Published:	2002
Subjects:	TK7800-8360 Electronics
Online Access:	http://shdl.mmu.edu.my/968/

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