Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer
Wafer thinning operation's parameters such as grit size, spindle speed, feed rate, tape material and the wafer handling mechanism are becoming very critical as the wafer becomes thinner. Temperature also plays a role in determining the amount of residual stresses on the wafers post thinning. T...
| Main Author: | |
|---|---|
| Format: | Thesis |
| Published: |
2002
|
| Subjects: | |
| Online Access: | http://shdl.mmu.edu.my/968/ |
| _version_ | 1848789671531773952 |
|---|---|
| author | Cheong, Yew Wee |
| author_facet | Cheong, Yew Wee |
| author_sort | Cheong, Yew Wee |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | Wafer thinning operation's parameters such as grit size, spindle speed, feed rate, tape material and the wafer handling mechanism are becoming very critical as the wafer becomes thinner. Temperature also plays a role in determining the amount of residual stresses on the wafers post thinning. The findings from this research will be very valuable for future assembly process development. |
| first_indexed | 2025-11-14T18:00:26Z |
| format | Thesis |
| id | mmu-968 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:00:26Z |
| publishDate | 2002 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-9682010-07-15T06:34:24Z http://shdl.mmu.edu.my/968/ Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer Cheong, Yew Wee TK7800-8360 Electronics Wafer thinning operation's parameters such as grit size, spindle speed, feed rate, tape material and the wafer handling mechanism are becoming very critical as the wafer becomes thinner. Temperature also plays a role in determining the amount of residual stresses on the wafers post thinning. The findings from this research will be very valuable for future assembly process development. 2002-09 Thesis NonPeerReviewed Cheong, Yew Wee (2002) Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer. Masters thesis, Multimedia University. http://myto.perpun.net.my/metoalogin/logina.php |
| spellingShingle | TK7800-8360 Electronics Cheong, Yew Wee Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer |
| title | Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer |
| title_full | Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer |
| title_fullStr | Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer |
| title_full_unstemmed | Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer |
| title_short | Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer |
| title_sort | study of the interaction between the functions of grit size and residual damage of an ultra thin wafer |
| topic | TK7800-8360 Electronics |
| url | http://shdl.mmu.edu.my/968/ http://shdl.mmu.edu.my/968/ |