Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement

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Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement

This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow conditio...

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Bibliographic Details
Main Author:	Chin, Yoong Tatt
Format:	Thesis
Published:	2002
Subjects:	TK7800-8360 Electronics
Online Access:	http://shdl.mmu.edu.my/965/

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