Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow conditio...
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| Format: | Thesis |
| Published: |
2002
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| Subjects: | |
| Online Access: | http://shdl.mmu.edu.my/965/ |
| _version_ | 1848789670692913152 |
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| author | Chin, Yoong Tatt |
| author_facet | Chin, Yoong Tatt |
| author_sort | Chin, Yoong Tatt |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow condition. |
| first_indexed | 2025-11-14T18:00:25Z |
| format | Thesis |
| id | mmu-965 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:00:25Z |
| publishDate | 2002 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-9652010-07-15T06:43:24Z http://shdl.mmu.edu.my/965/ Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement Chin, Yoong Tatt TK7800-8360 Electronics This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow condition. 2002-09 Thesis NonPeerReviewed Chin, Yoong Tatt (2002) Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement. Masters thesis, Multimedia University. http://myto.perpun.net.my/metoalogin/logina.php |
| spellingShingle | TK7800-8360 Electronics Chin, Yoong Tatt Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement |
| title | Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement |
| title_full | Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement |
| title_fullStr | Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement |
| title_full_unstemmed | Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement |
| title_short | Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement |
| title_sort | study of flip chip underfill materials to meet 260 celsius high temperature reflow requirement |
| topic | TK7800-8360 Electronics |
| url | http://shdl.mmu.edu.my/965/ http://shdl.mmu.edu.my/965/ |