APA (7th ed.) Citation

Chin, Y. T. (2002). Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement.

Chicago Style (17th ed.) Citation

Chin, Yoong Tatt. Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement. 2002.

MLA (9th ed.) Citation

Chin, Yoong Tatt. Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement. 2002.

Warning: These citations may not always be 100% accurate.