Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering

In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied. Parameters studied include solder wetting angle, oxidation, microstructures and solder joint strength.

Bibliographic Details
Main Author:	Chung, Chee Key
Format:	Thesis
Published:	2003
Subjects:	TK7800-8360 Electronics
Online Access:	http://shdl.mmu.edu.my/961/

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