Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging

QR Code

Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging

The flip chip-on-board technology of using Sn-Pb solder bump is becoming more common in the electronic packaging industry owing to cost saving in cladded printed circuit. But problem that plague the electronics packaging industry, like the non-wet solder joints, extrusion, etc, need to be studied. E...

Full description

Bibliographic Details
Main Author:	Yong, Su Kiat
Format:	Thesis
Published:	2002
Subjects:	TK7800-8360 Electronics
Online Access:	http://shdl.mmu.edu.my/960/

Similar Items

Lead Electromigration In Flip Chip Packaging Under Hast Environment
by: Wong, Shaw Hwang
Published: (2004)

EBB 526 ELECTRONIC PACKAGING OCT 04.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2004)

UWB antenna using indium tin oxide (ITO)
by: Abdul Latif, Nadiyatul Akmar
Published: (2014)

Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
by: Chung, Chee Key
Published: (2003)

EBB 526-3 - ELECTRONIC PACKAGING NOV 05.
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2005)

Pulsed Nd:YAG Laser Deposition Of Semiconducting And Transparent Indium-Tin-Oxide Anode For Organic Light Emitting Device
by: Yong, Thian Kok
Published: (2007)

Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
by: Mohamed Anuar, Rabiatul Adawiyah
Published: (2017)

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
by: Mayappan, Ramani
Published: (2007)

Blockchain-based electronic voting protocol
by: Clement, Chan Zheng Wei, et al.
Published: (2018)

Kajian Kesan Mikrostruktur Yang Berbeza Terhadap Sifat Dielektrik Cacu3ti4o12 [TK7871.15.C4 J94 2008 f rb].
by: Mohamed, Julie Juliewatty
Published: (2008)

Case Study Of Possehl Electronics Malaysia Sdn Bhd
by: Mah, Kah Gee
Published: (2005)

Delafossite oxide materials as a p-type transparent conducting oxide
by: Alias, Afishah, et al.
Published: (2019)

Microchannel Heat Sinks For Cooling High Heat Flux Electronic Devices-Analysis With Single And Two Phase Flows [TK7872.H4 P896 2006 f rb].
by: Hegde, Pradeep Ganesh
Published: (2006)

VLSI Design Of A Bit Serial Arithmetic Logic Unit
by: Lee, Tiong Kiat
Published: (2003)

EBB 525-3 - ELECTRONICS MATERIALS & OPTICAL DEVICES NOV 2008
by: PPKBSM, Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
Published: (2008)

Pengoptimunan Proses Pengkalsinan Dan Pensinteran Untuk Manghasilkan Kalsium Kuprum Mangan Oksida (Cacu3mn4o12) Melalui Kaedah Tindakbalas Keadaan Pepejal [TK7871.15.C4 W276 2008 f rb].
by: Abd Rashid, Mohd Warikh
Published: (2007)

Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
by: Goh, Teck Joo
Published: (2004)

Monte Carlo Modelling Of High Field Electron Transport And Impact Ionisation In Semiconductors
by: Choo , Kan Yeep
Published: (2005)

3D (Demand Driven Development) Program: Industry-Academia Collaboration (IAC) for the E&E Sector-IC Design Cluster leading by CEDEC, USM
by: CEDEC, Pusat Usahasama Kecemerlangan Rekabentuk Mikroelektronik
Published: (2015)

Fabrication Of Submicron HEMT Mushroom Gate Structure Using Electron Beam Lithography And Its Characterization
by: Yusof, Ashaari
Published: (2008)

Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering
by: Chong, Jia Jun
Published: (2019)

Development Of Simple I3c Controller Bus Functional Modeling For Internal Test Card Verification
by: Puan , Chia Kian
Published: (2016)

Post-Silicon General Bus Function Model Modelling Approach Using C Code For Test Scheme Reuse And Sharing
by: Chang , Ling Kwai
Published: (2014)

Optimization of gadolinium-doped zinc oxide films for diluted magnetic semiconductor and its effects on organic solar cell performance
by: Che Ani, Noorhidayah
Published: (2017)

Fabrication of high-quality electrode films for solid oxide fuel cell by screen printing: A review on important processing parameters
by: Baharuddin, Nurul Akidah, et al.
Published: (2020)

Variability reduction in stencil printing of solder paste for surface mount technology
by: Ibrahim, Mustaffa
Published: (1998)

The Effects Of Zinc Oxide Microstructure On The Electrical Characteristics Of Low-Voltage Ceramic Varistors. [TK7871.99.V3S525frb] [Microfiche 7646]
by: Ahmad, Shahrom
Published: (2004)

Preparation of Aniline Dimer-COOH Modified Magnetite (Fe3O4) Nanoparticles by ultrasonic dispersion method
by: Taka, Zakiyyu Ibrahim, et al.
Published: (2018)

A Cost And Power Efficient Ddr4/Gddr5x/Gddr5 Transmitter With 3-Tap Equalizer
by: Ng , Hoong Chin
Published: (2016)

High Performance Current Amplifier [TK7871.58.P4 G896 2006 f rb] [Microfiche 8561].
by: Gu, Hock Chin
Published: (2006)

Design And Simulation Of Cmos-Based Low Voltage Variation Bandgap Reference Voltage Circuitry Using 0.18μm Process Technology
by: Tan, Chee Yong
Published: (2015)

Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
by: Loo , Kean Ann
Published: (2017)

Design and Implementation of Low Power and High Performance 4 Bit Carry Lookahead Full Adder Using Finfet Technology
by: Lim, Nguk Jie
Published: (2015)

The effect of electronic word of mouth communication on purchase intention moderate by trust: a case online consumer of Bahawalpur Pakistan
by: Ahmad, Naveed, et al.
Published: (2020)

The investigation on the factors that affect the resistance of drain-to-source in semiconductor packaging
by: Chua, King Lee
Published: (2004)

Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
by: Chan, Sook Chien
Published: (2002)

Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
by: Chin, Yoong Tatt
Published: (2002)

Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer
by: Cheong, Yew Wee
Published: (2002)

Optical Scattering Detection And Characterisation Of Crystal Originated Particles In Czochralski-Grown Silicon Wafers
by: Lee , Wah Pheng
Published: (2005)

A Case Study On Business Strategy Formulation For An Industrial Semiconductor's Memory Divisions
by: Keong, Bun Hin
Published: (2005)