APA (7th ed.) Citation

Yong, S. K. (2002). Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging.

Chicago Style (17th ed.) Citation

Yong, Su Kiat. Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging. 2002.

MLA (9th ed.) Citation

Yong, Su Kiat. Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging. 2002.

Warning: These citations may not always be 100% accurate.