Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System
The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate.
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| Format: | Thesis |
| Published: |
2002
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| Online Access: | http://shdl.mmu.edu.my/944/ |
| _version_ | 1848789643611340800 |
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| author | Chan, Sook Chien |
| author_facet | Chan, Sook Chien |
| author_sort | Chan, Sook Chien |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate. |
| first_indexed | 2025-11-14T17:59:59Z |
| format | Thesis |
| id | mmu-944 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T17:59:59Z |
| publishDate | 2002 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-9442010-07-13T03:06:56Z http://shdl.mmu.edu.my/944/ Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System Chan, Sook Chien TK7800-8360 Electronics The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate. 2002-09 Thesis NonPeerReviewed Chan, Sook Chien (2002) Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System. Masters thesis, Multimedia University. http://myto.perpun.net.my/metoalogin/logina.php |
| spellingShingle | TK7800-8360 Electronics Chan, Sook Chien Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System |
| title | Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System |
| title_full | Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System |
| title_fullStr | Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System |
| title_full_unstemmed | Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System |
| title_short | Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System |
| title_sort | effects of intermetallic growth and bonding parameters on wire- bond strength for gold - aluminium system |
| topic | TK7800-8360 Electronics |
| url | http://shdl.mmu.edu.my/944/ http://shdl.mmu.edu.my/944/ |