Lead Electromigration In Flip Chip Packaging Under Hast Environment

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Lead Electromigration In Flip Chip Packaging Under Hast Environment

Failure under HAST condition will cause device malfunction. Lead migration can occur under HAST stress when two signals are biased. Lead migrates from solder bump to the adjacent copper trace in substrate causing electrical failure. The focus of this project is on the failure mechanism of the lead...

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Bibliographic Details
Main Author:	Wong, Shaw Hwang
Format:	Thesis
Published:	2004
Subjects:	TK7800-8360 Electronics
Online Access:	http://shdl.mmu.edu.my/941/

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