Lead Electromigration In Flip Chip Packaging Under Hast Environment
Failure under HAST condition will cause device malfunction. Lead migration can occur under HAST stress when two signals are biased. Lead migrates from solder bump to the adjacent copper trace in substrate causing electrical failure. The focus of this project is on the failure mechanism of the lead...
| Main Author: | |
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| Format: | Thesis |
| Published: |
2004
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| Subjects: | |
| Online Access: | http://shdl.mmu.edu.my/941/ |
| _version_ | 1848789642770382848 |
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| author | Wong, Shaw Hwang |
| author_facet | Wong, Shaw Hwang |
| author_sort | Wong, Shaw Hwang |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | Failure under HAST condition will cause device malfunction. Lead migration can occur under HAST stress when two signals are biased. Lead migrates from solder bump to the adjacent copper trace in substrate causing electrical failure.
The focus of this project is on the failure mechanism of the lead migration to understand how the lead migrates from bump. |
| first_indexed | 2025-11-14T17:59:58Z |
| format | Thesis |
| id | mmu-941 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T17:59:58Z |
| publishDate | 2004 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-9412010-07-13T03:08:57Z http://shdl.mmu.edu.my/941/ Lead Electromigration In Flip Chip Packaging Under Hast Environment Wong, Shaw Hwang TK7800-8360 Electronics Failure under HAST condition will cause device malfunction. Lead migration can occur under HAST stress when two signals are biased. Lead migrates from solder bump to the adjacent copper trace in substrate causing electrical failure. The focus of this project is on the failure mechanism of the lead migration to understand how the lead migrates from bump. 2004-12 Thesis NonPeerReviewed Wong, Shaw Hwang (2004) Lead Electromigration In Flip Chip Packaging Under Hast Environment. Masters thesis, Multimedia University. http://myto.perpun.net.my/metoalogin/logina.php |
| spellingShingle | TK7800-8360 Electronics Wong, Shaw Hwang Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title | Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_full | Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_fullStr | Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_full_unstemmed | Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_short | Lead Electromigration In Flip Chip Packaging Under Hast Environment |
| title_sort | lead electromigration in flip chip packaging under hast environment |
| topic | TK7800-8360 Electronics |
| url | http://shdl.mmu.edu.my/941/ http://shdl.mmu.edu.my/941/ |