APA (7th ed.) Citation

Wong, S. H. (2004). Lead Electromigration In Flip Chip Packaging Under Hast Environment.

Chicago Style (17th ed.) Citation

Wong, Shaw Hwang. Lead Electromigration In Flip Chip Packaging Under Hast Environment. 2004.

MLA (9th ed.) Citation

Wong, Shaw Hwang. Lead Electromigration In Flip Chip Packaging Under Hast Environment. 2004.

Warning: These citations may not always be 100% accurate.