Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding

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Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding

In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation s...

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Bibliographic Details
Main Author:	Lee, Foo Yeong
Format:	Thesis
Published:	2011
Subjects:	TK7800-8360 Electronics
Online Access:	http://shdl.mmu.edu.my/3470/

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