Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding
In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation s...
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| Format: | Thesis |
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2011
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| Online Access: | http://shdl.mmu.edu.my/3470/ |
| _version_ | 1848790335799427072 |
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| author | Lee, Foo Yeong |
| author_facet | Lee, Foo Yeong |
| author_sort | Lee, Foo Yeong |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation software instead of commercial CAD application to generate the bonding path component of the wire bonding program. |
| first_indexed | 2025-11-14T18:10:59Z |
| format | Thesis |
| id | mmu-3470 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:10:59Z |
| publishDate | 2011 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-34702012-04-09T04:14:41Z http://shdl.mmu.edu.my/3470/ Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding Lee, Foo Yeong TK7800-8360 Electronics In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation software instead of commercial CAD application to generate the bonding path component of the wire bonding program. 2011-03 Thesis NonPeerReviewed Lee, Foo Yeong (2011) Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding. Masters thesis, University of Multimedia. http://vlib.mmu.edu.my/diglib/login/dlusr/login.php |
| spellingShingle | TK7800-8360 Electronics Lee, Foo Yeong Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding |
| title | Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding |
| title_full | Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding |
| title_fullStr | Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding |
| title_full_unstemmed | Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding |
| title_short | Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding |
| title_sort | development, implementation and analysis of direct integration offline method in wire bonding |
| topic | TK7800-8360 Electronics |
| url | http://shdl.mmu.edu.my/3470/ http://shdl.mmu.edu.my/3470/ |