Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field
Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed...
| Main Authors: | , , , , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2008
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| Online Access: | http://shdl.mmu.edu.my/2829/ |
| _version_ | 1848790160887513088 |
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| author | R., Balachandran H. K., Yow B. H., Ong R. M., Manickam K., Anuar W. T, Teoh K. B., Tan |
| author_facet | R., Balachandran H. K., Yow B. H., Ong R. M., Manickam K., Anuar W. T, Teoh K. B., Tan |
| author_sort | R., Balachandran |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed the deposition of NiFe on Cu substrates and the crystallite size calculated from Scherrer's formula is 22.28 nm and 20.17 nm respectively for the films fabricated in the absence and presence of ultrasonic field. The grain sizes, from SEM micrographs, were found to be 225.52 nm and 79.64 nm respectively for the films fabricated in the absence and presence of ultrasonic field and the grains were in the shape of spherical balls. |
| first_indexed | 2025-11-14T18:08:12Z |
| format | Conference or Workshop Item |
| id | mmu-2829 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:08:12Z |
| publishDate | 2008 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-28292011-09-19T07:53:43Z http://shdl.mmu.edu.my/2829/ Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field R., Balachandran H. K., Yow B. H., Ong R. M., Manickam K., Anuar W. T, Teoh K. B., Tan T Technology (General) QA75.5-76.95 Electronic computers. Computer science Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed the deposition of NiFe on Cu substrates and the crystallite size calculated from Scherrer's formula is 22.28 nm and 20.17 nm respectively for the films fabricated in the absence and presence of ultrasonic field. The grain sizes, from SEM micrographs, were found to be 225.52 nm and 79.64 nm respectively for the films fabricated in the absence and presence of ultrasonic field and the grains were in the shape of spherical balls. 2008-11 Conference or Workshop Item NonPeerReviewed R., Balachandran and H. K., Yow and B. H., Ong and R. M., Manickam and K., Anuar and W. T, Teoh and K. B., Tan (2008) Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field. In: IEEE International Conference on Semiconductor Electronics, 25-27 Nov 2008, Johor Bahru, MALAYSIA . http://apps.webofknowledge.com/full_record.do?product=WOS&search_mode=GeneralSearch&qid=1&SID=N2eNo9mH22aE1IjOpib&page=87&doc=864 |
| spellingShingle | T Technology (General) QA75.5-76.95 Electronic computers. Computer science R., Balachandran H. K., Yow B. H., Ong R. M., Manickam K., Anuar W. T, Teoh K. B., Tan Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_full | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_fullStr | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_full_unstemmed | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_short | Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| title_sort | surface morphology of ni-fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field |
| topic | T Technology (General) QA75.5-76.95 Electronic computers. Computer science |
| url | http://shdl.mmu.edu.my/2829/ http://shdl.mmu.edu.my/2829/ |