Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

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Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

Both transient and steady-state experiments are performed to study the single-phase heat transfer characteristics on an array of four in-line, flush-mounted simulated chips in a vertical rectangular channel. Water is the coolant media, and the flow covers the wide range of laminar regimes with the R...

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Bibliographic Details
Main Authors:	Tso, C. P., Tou, K. W., Bhowmik, H.
Format:	Article
Published:	2004
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://shdl.mmu.edu.my/2422/

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