Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power
Both transient and steady-state experiments are performed to study the single-phase heat transfer characteristics on an array of four in-line, flush-mounted simulated chips in a vertical rectangular channel. Water is the coolant media, and the flow covers the wide range of laminar regimes with the R...
| Main Authors: | , , |
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| Format: | Article |
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2004
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| Online Access: | http://shdl.mmu.edu.my/2422/ |
| _version_ | 1848790051761160192 |
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| author | Tso, C. P. Tou, K. W. Bhowmik, H. |
| author_facet | Tso, C. P. Tou, K. W. Bhowmik, H. |
| author_sort | Tso, C. P. |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | Both transient and steady-state experiments are performed to study the single-phase heat transfer characteristics on an array of four in-line, flush-mounted simulated chips in a vertical rectangular channel. Water is the coolant media, and the flow covers the wide range of laminar regimes with the Reynolds number based on heat source length, from 800 to 2625. The effect of heat fluxes, coolant flow rates, and geometric parameters (such as chip configuration number) are investigated. The operation is extended to study the transient natural convection during an accidental stoppage of coolant flow due to loss of pumping power Results compare favorably with those obtained from three-dimensional numerical calculations. The transient correlation recommended is Nu(l)=0.3 (Fo)(-0.2) (Ra-l(*))(1/4). |
| first_indexed | 2025-11-14T18:06:28Z |
| format | Article |
| id | mmu-2422 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:06:28Z |
| publishDate | 2004 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-24222011-08-22T02:44:51Z http://shdl.mmu.edu.my/2422/ Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power Tso, C. P. Tou, K. W. Bhowmik, H. TA Engineering (General). Civil engineering (General) Both transient and steady-state experiments are performed to study the single-phase heat transfer characteristics on an array of four in-line, flush-mounted simulated chips in a vertical rectangular channel. Water is the coolant media, and the flow covers the wide range of laminar regimes with the Reynolds number based on heat source length, from 800 to 2625. The effect of heat fluxes, coolant flow rates, and geometric parameters (such as chip configuration number) are investigated. The operation is extended to study the transient natural convection during an accidental stoppage of coolant flow due to loss of pumping power Results compare favorably with those obtained from three-dimensional numerical calculations. The transient correlation recommended is Nu(l)=0.3 (Fo)(-0.2) (Ra-l(*))(1/4). 2004-12 Article NonPeerReviewed Tso, C. P. and Tou, K. W. and Bhowmik, H. (2004) Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power. Journal of Electronic Packaging, 126 (4). pp. 546-553. ISSN 10437398 http://dx.doi.org/10.1115/1.1827270 doi:10.1115/1.1827270 doi:10.1115/1.1827270 |
| spellingShingle | TA Engineering (General). Civil engineering (General) Tso, C. P. Tou, K. W. Bhowmik, H. Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power |
| title | Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power |
| title_full | Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power |
| title_fullStr | Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power |
| title_full_unstemmed | Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power |
| title_short | Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power |
| title_sort | experimental and numerical thermal transient behavior of chips in a liquid channel during loss of pumping power |
| topic | TA Engineering (General). Civil engineering (General) |
| url | http://shdl.mmu.edu.my/2422/ http://shdl.mmu.edu.my/2422/ http://shdl.mmu.edu.my/2422/ |