Performance analysis of grinding process via particle swarm optimization

Optimization is necessary for the control of any process to achieve better product quality, high productivity with low cost. The grinding of silicon carbide is not an easy task due to its low fracture toughness, making the material sensitive to cracking. The efficient grinding involves the optimal s...

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Main Authors: Ting, , TO, Tay, , TH, Lee, , TS
Format: Article
Published: 2005
Subjects:
Online Access:http://shdl.mmu.edu.my/2376/
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author Ting, , TO
Tay, , TH
Lee, , TS
author_facet Ting, , TO
Tay, , TH
Lee, , TS
author_sort Ting, , TO
building MMU Institutional Repository
collection Online Access
description Optimization is necessary for the control of any process to achieve better product quality, high productivity with low cost. The grinding of silicon carbide is not an easy task due to its low fracture toughness, making the material sensitive to cracking. The efficient grinding involves the optimal selection of operating parameters to maximize the Material Removal Rate (MRR) while maintaining the required surface finish and limiting surface damage. In this work, optimization based on the available model has been carried out to obtain optimum parameters for silicon carbide grinding via Particle Swarm Optimization (PSO) based on the objective of maximizing MRR with reference to surface finish and damage. Results obtained are superior in comparison with Genetic Algorithm (GA) approach.
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spelling mmu-23762011-08-23T00:39:12Z http://shdl.mmu.edu.my/2376/ Performance analysis of grinding process via particle swarm optimization Ting, , TO Tay, , TH Lee, , TS QA75.5-76.95 Electronic computers. Computer science Optimization is necessary for the control of any process to achieve better product quality, high productivity with low cost. The grinding of silicon carbide is not an easy task due to its low fracture toughness, making the material sensitive to cracking. The efficient grinding involves the optimal selection of operating parameters to maximize the Material Removal Rate (MRR) while maintaining the required surface finish and limiting surface damage. In this work, optimization based on the available model has been carried out to obtain optimum parameters for silicon carbide grinding via Particle Swarm Optimization (PSO) based on the objective of maximizing MRR with reference to surface finish and damage. Results obtained are superior in comparison with Genetic Algorithm (GA) approach. 2005 Article NonPeerReviewed Ting, , TO and Tay, , TH and Lee, , TS (2005) Performance analysis of grinding process via particle swarm optimization. ICCIMA 2005: Sixth International Conference on Computational Intelligence and Multimedia Applications, Proceedings . pp. 92-97.
spellingShingle QA75.5-76.95 Electronic computers. Computer science
Ting, , TO
Tay, , TH
Lee, , TS
Performance analysis of grinding process via particle swarm optimization
title Performance analysis of grinding process via particle swarm optimization
title_full Performance analysis of grinding process via particle swarm optimization
title_fullStr Performance analysis of grinding process via particle swarm optimization
title_full_unstemmed Performance analysis of grinding process via particle swarm optimization
title_short Performance analysis of grinding process via particle swarm optimization
title_sort performance analysis of grinding process via particle swarm optimization
topic QA75.5-76.95 Electronic computers. Computer science
url http://shdl.mmu.edu.my/2376/