Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package

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Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package

The lead-free Sn-Ag-Cu (SAC 305/405) solder that replaced the tin-lead eutectic solder tends to be more brittle in nature due to high stiffness and excessive solder interfacial reactions. This leads to higher occurrences of solder joints failure during surface mount assembly and handling operations...

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Bibliographic Details
Main Authors:	CHIN, Y, LAM, P, YOW, H, TOU, T
Format:	Article
Published:	PERGAMON-ELSEVIER SCIENCE LTD 2008
Subjects:	T Technology (General) QA75.5-76.95 Electronic computers. Computer science
Online Access:	http://shdl.mmu.edu.my/2292/

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