Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package
The lead-free Sn-Ag-Cu (SAC 305/405) solder that replaced the tin-lead eutectic solder tends to be more brittle in nature due to high stiffness and excessive solder interfacial reactions. This leads to higher occurrences of solder joints failure during surface mount assembly and handling operations...
| Main Authors: | , , , |
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| Format: | Article |
| Published: |
PERGAMON-ELSEVIER SCIENCE LTD
2008
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| Subjects: | |
| Online Access: | http://shdl.mmu.edu.my/2292/ |