Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package
The lead-free Sn-Ag-Cu (SAC 305/405) solder that replaced the tin-lead eutectic solder tends to be more brittle in nature due to high stiffness and excessive solder interfacial reactions. This leads to higher occurrences of solder joints failure during surface mount assembly and handling operations...
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| Format: | Article |
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PERGAMON-ELSEVIER SCIENCE LTD
2008
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| Online Access: | http://shdl.mmu.edu.my/2292/ |
| _version_ | 1848790016845676544 |
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| author | CHIN, Y LAM, P YOW, H TOU, T |
| author_facet | CHIN, Y LAM, P YOW, H TOU, T |
| author_sort | CHIN, Y |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | The lead-free Sn-Ag-Cu (SAC 305/405) solder that replaced the tin-lead eutectic solder tends to be more brittle in nature due to high stiffness and excessive solder interfacial reactions. This leads to higher occurrences of solder joints failure during surface mount assembly and handling operations as a result of PCB bending, shock impact and drop. In this work, mechanical tests simulating the shock impact were conducted on lead-free SAC of different weight percentages. These SAC materials were prepared for use in the solder joints of fine pitch ball grid array (BGA) components which were mounted onto the mother-board. After the mechanical shock tests, strain measurements were performed on the BGA components to gauge the solder joint integrity, which was shown to be related with the formation of intermetallics in the bulk and at the interface of the SAC solder. The ball pull tests were conducted to determine both the bulk and interfacial strength and the solder joint fracture, which was classified as either mode 1, 2 or 3. A correlation was made between the silver (Ag) and copper (Cu) weight percentages with the metallurgical reactions. (C) 2008 Elsevier Ltd. All rights reserved. |
| first_indexed | 2025-11-14T18:05:55Z |
| format | Article |
| id | mmu-2292 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:05:55Z |
| publishDate | 2008 |
| publisher | PERGAMON-ELSEVIER SCIENCE LTD |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-22922011-08-24T07:07:11Z http://shdl.mmu.edu.my/2292/ Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package CHIN, Y LAM, P YOW, H TOU, T T Technology (General) QA75.5-76.95 Electronic computers. Computer science The lead-free Sn-Ag-Cu (SAC 305/405) solder that replaced the tin-lead eutectic solder tends to be more brittle in nature due to high stiffness and excessive solder interfacial reactions. This leads to higher occurrences of solder joints failure during surface mount assembly and handling operations as a result of PCB bending, shock impact and drop. In this work, mechanical tests simulating the shock impact were conducted on lead-free SAC of different weight percentages. These SAC materials were prepared for use in the solder joints of fine pitch ball grid array (BGA) components which were mounted onto the mother-board. After the mechanical shock tests, strain measurements were performed on the BGA components to gauge the solder joint integrity, which was shown to be related with the formation of intermetallics in the bulk and at the interface of the SAC solder. The ball pull tests were conducted to determine both the bulk and interfacial strength and the solder joint fracture, which was classified as either mode 1, 2 or 3. A correlation was made between the silver (Ag) and copper (Cu) weight percentages with the metallurgical reactions. (C) 2008 Elsevier Ltd. All rights reserved. PERGAMON-ELSEVIER SCIENCE LTD 2008-07 Article NonPeerReviewed CHIN, Y and LAM, P and YOW, H and TOU, T (2008) Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package. Microelectronics Reliability, 48 (7). pp. 1079-1086. ISSN 00262714 http://dx.doi.org/10.1016/j.microrel.2008.04.003 doi:10.1016/j.microrel.2008.04.003 doi:10.1016/j.microrel.2008.04.003 |
| spellingShingle | T Technology (General) QA75.5-76.95 Electronic computers. Computer science CHIN, Y LAM, P YOW, H TOU, T Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package |
| title | Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package |
| title_full | Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package |
| title_fullStr | Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package |
| title_full_unstemmed | Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package |
| title_short | Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package |
| title_sort | investigation of mechanical shock testing of lead-free sac solder joints in fine pitch bga package |
| topic | T Technology (General) QA75.5-76.95 Electronic computers. Computer science |
| url | http://shdl.mmu.edu.my/2292/ http://shdl.mmu.edu.my/2292/ http://shdl.mmu.edu.my/2292/ |