CHIN, Y., LAM, P., YOW, H., & TOU, T. (2008). Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package. PERGAMON-ELSEVIER SCIENCE LTD.
Chicago Style (17th ed.) CitationCHIN, Y., P. LAM, H. YOW, and T. TOU. Investigation of Mechanical Shock Testing of Lead-free SAC Solder Joints in Fine Pitch BGA Package. PERGAMON-ELSEVIER SCIENCE LTD, 2008.
MLA (9th ed.) CitationCHIN, Y., et al. Investigation of Mechanical Shock Testing of Lead-free SAC Solder Joints in Fine Pitch BGA Package. PERGAMON-ELSEVIER SCIENCE LTD, 2008.
Warning: These citations may not always be 100% accurate.