An accurate solution for thermo-mechanical stresses in tri-material assembly in electronic packages

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An accurate solution for thermo-mechanical stresses in tri-material assembly in electronic packages

The closed-form solution of thermo-mechanical analysis of tri-material assembly is initially provided by Schmidt [1] in 1999 and Suhir (2] in 2003. However, there exist some contradictions and inconsistencies in both the solutions of Schmidt and Suhir. The contradiction arises in consideration of th...

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Bibliographic Details
Main Authors:	Sujan, ., D, Sridhar, , T. S., Seetharamu, , K. N., Murthy,, M. V. V., Hassan,, A. Y.
Format:	Article
Published:	2006
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://shdl.mmu.edu.my/2147/

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