Sujan, .., D, Sridhar, Seetharamu, Murthy,, M. V. V., & Hassan,, A. Y. (2006). An accurate solution for thermo-mechanical stresses in tri-material assembly in electronic packages.
Chicago Style (17th ed.) CitationSujan, .., D, Sridhar, Seetharamu, M. V. V. Murthy,, and A. Y. Hassan. An Accurate Solution for Thermo-mechanical Stresses in Tri-material Assembly in Electronic Packages. 2006.
MLA (9th ed.) CitationSujan, .., D, et al. An Accurate Solution for Thermo-mechanical Stresses in Tri-material Assembly in Electronic Packages. 2006.
Warning: These citations may not always be 100% accurate.