Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
This paper is aimed at studying the thermal distribution and its associated effects on a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated using Finite-Element Method with the help of a FEM software (Ansys Workbench 14). Physical changes of the structure s...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2015
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| Subjects: | |
| Online Access: | http://eprints.intimal.edu.my/234/ http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf |
| _version_ | 1848766428757360640 |
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| author | Xavier, A. Lim, C. S. |
| author_facet | Xavier, A. Lim, C. S. |
| author_sort | Xavier, A. |
| building | INTI Institutional Repository |
| collection | Online Access |
| description | This paper is aimed at studying the thermal distribution and its associated effects on
a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated
using Finite-Element Method with the help of a FEM software (Ansys Workbench 14).
Physical changes of the structure such as temperature change and deformation are measured
and are used as the basis for comparison between models of heat sinks. This paper also
attempts to study the effect of thermal loading on the materials found in a heat sink hardware in
terms of stresses that may arise due to physical restraints in the hardware as well as provide an
optimized solution to reduce its form factor in order to be comparable to an Ultrabook class
heat-sink. An optimized solution is made based on a cylindrical fin concept. |
| first_indexed | 2025-11-14T11:51:00Z |
| format | Article |
| id | intimal-234 |
| institution | INTI International University |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T11:51:00Z |
| publishDate | 2015 |
| publisher | IOP Publishing |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | intimal-2342016-09-15T07:40:59Z http://eprints.intimal.edu.my/234/ Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer Xavier, A. Lim, C. S. TJ Mechanical engineering and machinery This paper is aimed at studying the thermal distribution and its associated effects on a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated using Finite-Element Method with the help of a FEM software (Ansys Workbench 14). Physical changes of the structure such as temperature change and deformation are measured and are used as the basis for comparison between models of heat sinks. This paper also attempts to study the effect of thermal loading on the materials found in a heat sink hardware in terms of stresses that may arise due to physical restraints in the hardware as well as provide an optimized solution to reduce its form factor in order to be comparable to an Ultrabook class heat-sink. An optimized solution is made based on a cylindrical fin concept. IOP Publishing 2015 Article PeerReviewed text en http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf Xavier, A. and Lim, C. S. (2015) Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer. IOP Conference Series: Materials Science and Engineering, 88 (1). ISSN 1757-899X http://dx.doi.org/10.1088/1757-899X/88/1/012043 10.1088/1757-899X/88/1/012043 |
| spellingShingle | TJ Mechanical engineering and machinery Xavier, A. Lim, C. S. Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer |
| title | Simulation and Analysis of Temperature Distribution and
Material Properties Change of a Thermal Heat sink
Undergoing Thermal Loading in a Mobile Computer |
| title_full | Simulation and Analysis of Temperature Distribution and
Material Properties Change of a Thermal Heat sink
Undergoing Thermal Loading in a Mobile Computer |
| title_fullStr | Simulation and Analysis of Temperature Distribution and
Material Properties Change of a Thermal Heat sink
Undergoing Thermal Loading in a Mobile Computer |
| title_full_unstemmed | Simulation and Analysis of Temperature Distribution and
Material Properties Change of a Thermal Heat sink
Undergoing Thermal Loading in a Mobile Computer |
| title_short | Simulation and Analysis of Temperature Distribution and
Material Properties Change of a Thermal Heat sink
Undergoing Thermal Loading in a Mobile Computer |
| title_sort | simulation and analysis of temperature distribution and
material properties change of a thermal heat sink
undergoing thermal loading in a mobile computer |
| topic | TJ Mechanical engineering and machinery |
| url | http://eprints.intimal.edu.my/234/ http://eprints.intimal.edu.my/234/ http://eprints.intimal.edu.my/234/ http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf |