Development of zinc based alloy for solderability
Zinc based alloy is being proposed as an alternative material in metal based giftware industry. Most of the giftware is handmade using simple process such as casting, polishing and soldering. Soldering of commercial zinc alloy is difficult due to poor bonding between solder material and base meta...
| Main Authors: | , , , |
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| Format: | Proceeding Paper |
| Language: | English |
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2011
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/8003/ http://irep.iium.edu.my/8003/1/icmme2011_submission_62.pdf |
| _version_ | 1848776936433647616 |
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| author | Mustafa, Mohd. Yusry Adesta, Erry Yulian Triblas Purwanto, Hadi Md. Azizan, Farihan |
| author_facet | Mustafa, Mohd. Yusry Adesta, Erry Yulian Triblas Purwanto, Hadi Md. Azizan, Farihan |
| author_sort | Mustafa, Mohd. Yusry |
| building | IIUM Repository |
| collection | Online Access |
| description | Zinc based alloy is being proposed as an alternative material in metal based giftware industry.
Most of the giftware is handmade using simple process such as casting, polishing and
soldering. Soldering of commercial zinc alloy is difficult due to poor bonding between solder
material and base metal. Therefore, development of casting material is necessary to improve
the solder properties. This work investigates the effect of aluminum and tin additions on the
solder properties of zinc based alloy. Solder properties were studied based on the spread area
and adhesion of molten solder alloy when it contacts the base metal. Experimental work was
carried out by putting the base metal on an electrically heated aluminum block with the
temperature set at 265°C. Solder alloy was first dipped in the flux solution and then
transferred to the top of the base metal. The spread area values of the solidified solder alloy
on the base metal were then estimated.
Furthermore, scanning electron microscope (SEM) microstructure study and energy
dispersive X-ray spectroscopy (EDX) elemental analysis were conducted. The results showed
that tin addition has significant effect on the spread area compared to aluminum. Similarly,
adhesions between base metal and solder alloy were positive for zinc alloyed with tin unlike
zinc alloyed with aluminum. |
| first_indexed | 2025-11-14T14:38:00Z |
| format | Proceeding Paper |
| id | iium-8003 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T14:38:00Z |
| publishDate | 2011 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-80032011-12-02T08:21:07Z http://irep.iium.edu.my/8003/ Development of zinc based alloy for solderability Mustafa, Mohd. Yusry Adesta, Erry Yulian Triblas Purwanto, Hadi Md. Azizan, Farihan TN600 Metallurgy Zinc based alloy is being proposed as an alternative material in metal based giftware industry. Most of the giftware is handmade using simple process such as casting, polishing and soldering. Soldering of commercial zinc alloy is difficult due to poor bonding between solder material and base metal. Therefore, development of casting material is necessary to improve the solder properties. This work investigates the effect of aluminum and tin additions on the solder properties of zinc based alloy. Solder properties were studied based on the spread area and adhesion of molten solder alloy when it contacts the base metal. Experimental work was carried out by putting the base metal on an electrically heated aluminum block with the temperature set at 265°C. Solder alloy was first dipped in the flux solution and then transferred to the top of the base metal. The spread area values of the solidified solder alloy on the base metal were then estimated. Furthermore, scanning electron microscope (SEM) microstructure study and energy dispersive X-ray spectroscopy (EDX) elemental analysis were conducted. The results showed that tin addition has significant effect on the spread area compared to aluminum. Similarly, adhesions between base metal and solder alloy were positive for zinc alloyed with tin unlike zinc alloyed with aluminum. 2011 Proceeding Paper NonPeerReviewed application/pdf en http://irep.iium.edu.my/8003/1/icmme2011_submission_62.pdf Mustafa, Mohd. Yusry and Adesta, Erry Yulian Triblas and Purwanto, Hadi and Md. Azizan, Farihan (2011) Development of zinc based alloy for solderability. In: International Conference in Mechanical & Manufacturing Engineering (ICME 2011), 6-8 June 2011, Putrajaya,Kuala Lumpur. (Unpublished) |
| spellingShingle | TN600 Metallurgy Mustafa, Mohd. Yusry Adesta, Erry Yulian Triblas Purwanto, Hadi Md. Azizan, Farihan Development of zinc based alloy for solderability |
| title | Development of zinc based alloy for solderability |
| title_full | Development of zinc based alloy for solderability |
| title_fullStr | Development of zinc based alloy for solderability |
| title_full_unstemmed | Development of zinc based alloy for solderability |
| title_short | Development of zinc based alloy for solderability |
| title_sort | development of zinc based alloy for solderability |
| topic | TN600 Metallurgy |
| url | http://irep.iium.edu.my/8003/ http://irep.iium.edu.my/8003/1/icmme2011_submission_62.pdf |