Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)
. Over the years, the technology of electronic industry has growth tremendously. Open ended research on how to make a better concept of electronic circuit is ongoing especially on the stretchable electronic devices. There are many designs to achieve stretchability in electronic circuits. The prob...
| Main Authors: | , , , |
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| Format: | Proceeding Paper |
| Language: | English English English |
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Institute of Physics Publishing
2018
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| Online Access: | http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/1/64549_Finite%20element%20analysis%20on%20deformation_conference%20article.pdf http://irep.iium.edu.my/64549/2/64549_Finite%20element%20analysis%20on%20deformation_scopus.pdf http://irep.iium.edu.my/64549/13/64549_Finite%20element%20analysis%20on%20deformation_WoS.pdf |
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| author | Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri |
| author_facet | Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri |
| author_sort | Roslan, Muhamad Fahmi Mohd |
| building | IIUM Repository |
| collection | Online Access |
| description | . Over the years, the technology of electronic industry has growth tremendously. Open
ended research on how to make a better concept of electronic circuit is ongoing especially on
the stretchable electronic devices. There are many designs to achieve stretchability in electronic
circuits. The problem occurs when deformation applied to the stretchable electronic circuit, it
cannot maintain its functionality. Fracture may happen on the conductor. In this research, the
study on deformation of stretchable electronic interconnects substrate using
Polydimethlysiloxanes is carried out. The purpose of this research are to study the axial
deformation occur, to determine the optimum shape of the conductor designs (horseshoe,
rectangular and u-shape design) for the stretchable electronic interconnect and to compare the
mechanical properties of Polydimethlysiloxanes (PDMS) with Polyurethane (PU) using Finite
Element Analysis (FEA). The simulation was done on the FE model of the stretchable circuit
with dimension of 2.4 X 2.4 X 0.5 mm. The stretching of the FE model was simulated with the
range of elongation at 10, 20 and 30 percent from its original length in order to find the strain
value for all three of the conductor designs. The best conductor design is used to simulate with
different types of substrate (PDMS and PU). From the simulation result, Horseshoe design
record the lowest strain value for each elongation, followed by rectangular and U-shape design.
Thus, Horseshoe is considered as the optimum design for the conductor compared to the other
two designs. From the result also, it shows that PDMS substrate will offer more maximum
allowable stretchability compared to PU substrates. Thus PDMS is considered as a better
substrate compare to PU. PDMS is a good material to replace PU since it can perform under
tension much better mechanically. |
| first_indexed | 2025-11-14T17:05:51Z |
| format | Proceeding Paper |
| id | iium-64549 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English English English |
| last_indexed | 2025-11-14T17:05:51Z |
| publishDate | 2018 |
| publisher | Institute of Physics Publishing |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-645492019-01-24T00:52:20Z http://irep.iium.edu.my/64549/ Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery . Over the years, the technology of electronic industry has growth tremendously. Open ended research on how to make a better concept of electronic circuit is ongoing especially on the stretchable electronic devices. There are many designs to achieve stretchability in electronic circuits. The problem occurs when deformation applied to the stretchable electronic circuit, it cannot maintain its functionality. Fracture may happen on the conductor. In this research, the study on deformation of stretchable electronic interconnects substrate using Polydimethlysiloxanes is carried out. The purpose of this research are to study the axial deformation occur, to determine the optimum shape of the conductor designs (horseshoe, rectangular and u-shape design) for the stretchable electronic interconnect and to compare the mechanical properties of Polydimethlysiloxanes (PDMS) with Polyurethane (PU) using Finite Element Analysis (FEA). The simulation was done on the FE model of the stretchable circuit with dimension of 2.4 X 2.4 X 0.5 mm. The stretching of the FE model was simulated with the range of elongation at 10, 20 and 30 percent from its original length in order to find the strain value for all three of the conductor designs. The best conductor design is used to simulate with different types of substrate (PDMS and PU). From the simulation result, Horseshoe design record the lowest strain value for each elongation, followed by rectangular and U-shape design. Thus, Horseshoe is considered as the optimum design for the conductor compared to the other two designs. From the result also, it shows that PDMS substrate will offer more maximum allowable stretchability compared to PU substrates. Thus PDMS is considered as a better substrate compare to PU. PDMS is a good material to replace PU since it can perform under tension much better mechanically. Institute of Physics Publishing 2018-01-30 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/64549/1/64549_Finite%20element%20analysis%20on%20deformation_conference%20article.pdf application/pdf en http://irep.iium.edu.my/64549/2/64549_Finite%20element%20analysis%20on%20deformation_scopus.pdf application/pdf en http://irep.iium.edu.my/64549/13/64549_Finite%20element%20analysis%20on%20deformation_WoS.pdf Roslan, Muhamad Fahmi Mohd and Shaffiar, Norhashimah and Muhamad Khairussaleh, Nor Khairusshima and Syed Shaharuddin, Sharifah Imihezri (2018) Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS). In: International Conference on Advances in Manufacturing and Materials Engineering 2017, ICAMME 2017, 8 - 9 August 2017, Gombak, Kuala Lumpur. http://iopscience.iop.org/article/10.1088/1757-899X/290/1/012022/pdf 10.1088/1757-899X/290/1/012022 |
| spellingShingle | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) |
| title | Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) |
| title_full | Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) |
| title_fullStr | Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) |
| title_full_unstemmed | Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) |
| title_short | Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) |
| title_sort | finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (pdms) |
| topic | T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery |
| url | http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/1/64549_Finite%20element%20analysis%20on%20deformation_conference%20article.pdf http://irep.iium.edu.my/64549/2/64549_Finite%20element%20analysis%20on%20deformation_scopus.pdf http://irep.iium.edu.my/64549/13/64549_Finite%20element%20analysis%20on%20deformation_WoS.pdf |