Fabrication of micro magnetometer using flip-chip bonding

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Fabrication of micro magnetometer using flip-chip bonding

Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable a...

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Bibliographic Details
Main Authors:	Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
Format:	Article
Language:	English
Published:	Institute of Technology and Research 2017
Subjects:	TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
Online Access:	http://irep.iium.edu.my/62817/ http://irep.iium.edu.my/62817/1/IJMPE%20-%20Nadzril_Afif.pdf

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