Flip-chip bonding fabrication technique

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Flip-chip bonding fabrication technique

Military systems, outer space exploration and even in medical diagnosis and treatment used magnetic field detection. Low magnetic field detection is particularly important in tracking of magnetic. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment....

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Bibliographic Details
Main Authors:	Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
Format:	Proceeding Paper
Language:	English English
Published:	IOP Publishing 2017
Subjects:	T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
Online Access:	http://irep.iium.edu.my/59213/ http://irep.iium.edu.my/59213/1/ICOM%2717%20_%20IOP%20Published_%20Afif.pdf http://irep.iium.edu.my/59213/12/59213_Flip-Chip%20Bonding%20Fabrication%20Technique_scopus.pdf

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