Fabrication of micro magnetometer using flip-chip
bonding technique

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Fabrication of micro magnetometer using flip-chip bonding technique

Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable an...

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Bibliographic Details
Main Authors:	Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
Format:	Proceeding Paper
Language:	English
Published:	2017
Subjects:	TK Electrical engineering. Electronics Nuclear engineering TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
Online Access:	http://irep.iium.edu.my/56707/ http://irep.iium.edu.my/56707/12/56707_fabrication%20%20of%20Micro%20Magnet%20Magnetometer_complete.pdf

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