An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining

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An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining

Micro Wire Electro Discharge Machining (μ-WEDM) is a non-conventional promising machining process which is used mainly to machine complex shaped parts for research and industrial applications. However, for machining semiconductor material with high resistivity like silicon (Si) requires some speci...

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Bibliographic Details
Main Authors:	Jarin, Sams, Saleh, Tanveer, Bhuiyan, Moinul, Muthalif, Asan G. A., Ali, Mohammad Yeakub
Format:	Proceeding Paper
Language:	English English
Published:	2017
Subjects:	T Technology (General)
Online Access:	http://irep.iium.edu.my/56270/ http://irep.iium.edu.my/56270/1/060.pdf http://irep.iium.edu.my/56270/19/56270.pdf

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