Modelling and optimization of copper electroplating adhesion strength

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Modelling and optimization of copper electroplating adhesion strength

In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion stre...

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Bibliographic Details
Main Authors:	-, Suryanto, Haider, Farag, Ani, Mohd Hanafi, Mahmood, Mahmood Hameed
Format:	Article
Language:	English English English
Published:	Institute of Physics 2017
Subjects:	TA401 Materials of engineering and construction
Online Access:	http://irep.iium.edu.my/55778/ http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf

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