Fabrication of dual- and single-layer piezo resistive micro cantilever sensor
In this paper, the fabrication of piezoresistive microcantilever (PRM) sensor was realized through the utilization of bulk micromachining technology. Through a sequence of photolithography and etching processes, the device fabrication is realized. The fabrication of two PRM designs, dual-layer and...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Asian Research Publishing Network (ARPN)
2015
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/44474/ http://irep.iium.edu.my/44474/1/journal_ARPN_published.pdf |
| _version_ | 1848782613889679360 |
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| author | Ab Rahim, Rosminazuin Bais, Badariah Majlis, Yeop Burhanuddin |
| author_facet | Ab Rahim, Rosminazuin Bais, Badariah Majlis, Yeop Burhanuddin |
| author_sort | Ab Rahim, Rosminazuin |
| building | IIUM Repository |
| collection | Online Access |
| description | In this paper, the fabrication of piezoresistive microcantilever (PRM) sensor was realized through the utilization
of bulk micromachining technology. Through a sequence of photolithography and etching processes, the device fabrication
is realized. The fabrication of two PRM designs, dual-layer and single-layer has opened up the opportunity for device
improvement especially in fabrication methods for simpler and reduced process steps. In single-layer design, the
fabrication at reduced process steps which offers simpler and reproducible device has been successfully realized. This
design offers simpler fabrication process by not only reducing the number of process steps but also eliminating the
common fabrication issues encountered in bulk micromachining technology. With the development of single-layer doped
silicon PRM sensor, the thermal strain issue, due to mismatch in coefficients of thermal expansion of multi-layered
structure is not an issue. The novelty of this work lies in the design itself, in which the single-layer dual leg design not only
simplifies the fabrication work, but also promotes an efficient current distribution along the piezoresistive dual-leg
structure which is integrated with Wheatstone bridge configuration. |
| first_indexed | 2025-11-14T16:08:15Z |
| format | Article |
| id | iium-44474 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T16:08:15Z |
| publishDate | 2015 |
| publisher | Asian Research Publishing Network (ARPN) |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-444742015-10-13T04:52:05Z http://irep.iium.edu.my/44474/ Fabrication of dual- and single-layer piezo resistive micro cantilever sensor Ab Rahim, Rosminazuin Bais, Badariah Majlis, Yeop Burhanuddin TA168 Systems engineering In this paper, the fabrication of piezoresistive microcantilever (PRM) sensor was realized through the utilization of bulk micromachining technology. Through a sequence of photolithography and etching processes, the device fabrication is realized. The fabrication of two PRM designs, dual-layer and single-layer has opened up the opportunity for device improvement especially in fabrication methods for simpler and reduced process steps. In single-layer design, the fabrication at reduced process steps which offers simpler and reproducible device has been successfully realized. This design offers simpler fabrication process by not only reducing the number of process steps but also eliminating the common fabrication issues encountered in bulk micromachining technology. With the development of single-layer doped silicon PRM sensor, the thermal strain issue, due to mismatch in coefficients of thermal expansion of multi-layered structure is not an issue. The novelty of this work lies in the design itself, in which the single-layer dual leg design not only simplifies the fabrication work, but also promotes an efficient current distribution along the piezoresistive dual-leg structure which is integrated with Wheatstone bridge configuration. Asian Research Publishing Network (ARPN) 2015-08 Article PeerReviewed application/pdf en http://irep.iium.edu.my/44474/1/journal_ARPN_published.pdf Ab Rahim, Rosminazuin and Bais, Badariah and Majlis, Yeop Burhanuddin (2015) Fabrication of dual- and single-layer piezo resistive micro cantilever sensor. ARPN Journal of Engineering and Applied Sciences, 10 (15). pp. 6274-6278. ISSN 1819-6608 http://www.arpnjournals.com/jeas/research_papers/rp_2015/jeas_0815_2401.pdf |
| spellingShingle | TA168 Systems engineering Ab Rahim, Rosminazuin Bais, Badariah Majlis, Yeop Burhanuddin Fabrication of dual- and single-layer piezo resistive micro cantilever sensor |
| title | Fabrication of dual- and single-layer piezo resistive micro cantilever sensor |
| title_full | Fabrication of dual- and single-layer piezo resistive micro cantilever sensor |
| title_fullStr | Fabrication of dual- and single-layer piezo resistive micro cantilever sensor |
| title_full_unstemmed | Fabrication of dual- and single-layer piezo resistive micro cantilever sensor |
| title_short | Fabrication of dual- and single-layer piezo resistive micro cantilever sensor |
| title_sort | fabrication of dual- and single-layer piezo resistive micro cantilever sensor |
| topic | TA168 Systems engineering |
| url | http://irep.iium.edu.my/44474/ http://irep.iium.edu.my/44474/ http://irep.iium.edu.my/44474/1/journal_ARPN_published.pdf |