Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

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Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package

This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-...

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Bibliographic Details
Main Authors:	Shaffiar, Norhashimah, Loh, W.K., Kamsah, N.
Format:	Proceeding Paper
Language:	English
Published:	2010
Subjects:	TA349 Mechanics of engineering. Applied mechanics
Online Access:	http://irep.iium.edu.my/39333/ http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf

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