Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-...
| Main Authors: | , , |
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| Format: | Proceeding Paper |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/39333/ http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf |
| _version_ | 1848781763908730880 |
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| author | Shaffiar, Norhashimah Loh, W.K. Kamsah, N. |
| author_facet | Shaffiar, Norhashimah Loh, W.K. Kamsah, N. |
| author_sort | Shaffiar, Norhashimah |
| building | IIUM Repository |
| collection | Online Access |
| description | This study examines evolution characteristics of inelastic
strains and materials damage in Sn-4Ag-0.5Cu (SAC405)
solder joints of a BGA package under cyclic mechanical
stressing. For this purpose, a finite element model of the
assembly under four-point bend test set-up is employed.
Strain rate-dependent response of the solder is represented
by Anand model. Progressive damage in the solder joint is
described using continuum damage model. Results show that the critical solder joint is the one located at the corner of the BGA package. In this critical solder joint, both high
stress and inelastic strain are localized in a small edge region at the solder/IMC interface at the board side of the assembly. The different inelastic strain rates experienced by the critical solder joint during fatigue cycles correspond to the distinct damage initiation stage, crack propagation stage and the final fast fracture of the solder joint. Damage initiation life covers nearly half of the total fatigue lives of the critical solder. |
| first_indexed | 2025-11-14T15:54:44Z |
| format | Proceeding Paper |
| id | iium-39333 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T15:54:44Z |
| publishDate | 2010 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-393332015-01-08T09:39:24Z http://irep.iium.edu.my/39333/ Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package Shaffiar, Norhashimah Loh, W.K. Kamsah, N. TA349 Mechanics of engineering. Applied mechanics This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-dependent response of the solder is represented by Anand model. Progressive damage in the solder joint is described using continuum damage model. Results show that the critical solder joint is the one located at the corner of the BGA package. In this critical solder joint, both high stress and inelastic strain are localized in a small edge region at the solder/IMC interface at the board side of the assembly. The different inelastic strain rates experienced by the critical solder joint during fatigue cycles correspond to the distinct damage initiation stage, crack propagation stage and the final fast fracture of the solder joint. Damage initiation life covers nearly half of the total fatigue lives of the critical solder. 2010 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. (2010) Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package. In: 34th International Electronics Manufacturing Technology Conference (IEMT 2010), 30th - 2nd November 2010 , Melaka. |
| spellingShingle | TA349 Mechanics of engineering. Applied mechanics Shaffiar, Norhashimah Loh, W.K. Kamsah, N. Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package |
| title | Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package |
| title_full | Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package |
| title_fullStr | Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package |
| title_full_unstemmed | Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package |
| title_short | Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package |
| title_sort | progressive damage in sn-4ag-0.5cu solder joints during flexural fatigue of a bga package |
| topic | TA349 Mechanics of engineering. Applied mechanics |
| url | http://irep.iium.edu.my/39333/ http://irep.iium.edu.my/39333/1/IEMT_2010_Progressive_Damage_in_Sn-4Ag-0.5Cu_Solder_Joints_during_Flexural_Fatigue_of_a_BGA_Package.pdf |