Damage progression in BGA solder joints during board-level drop test

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Damage progression in BGA solder joints during board-level drop test

This study examines the dynamic fracture propagation experienced by critical solder joints in a BGA test package during board-level single drop test. An Input-G loading method is employed to simulate a drop test condition with a peak acceleration of 1500G within a time duration of 0.5 ms. Unifie...

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Bibliographic Details
Main Authors:	Yamin, A.F.M., Shaffiar, Norhashimah, Loh, W.K., Tamin, M.N.
Format:	Proceeding Paper
Language:	English
Published:	2011
Subjects:	TA349 Mechanics of engineering. Applied mechanics
Online Access:	http://irep.iium.edu.my/39332/ http://irep.iium.edu.my/39332/1/EPTC_Damage_Progression_in_BGA_Solder_Joints_during_Board-Level_Drop_Test.pdf

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