Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

QR Code

Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Per...

Full description

Bibliographic Details
Main Authors:	Yamin, A.F.M., Shaffiar, N.M., Loh, W.K., Tamin, M.N.
Format:	Proceeding Paper
Language:	English
Published:	2012
Subjects:	T Technology (General)
Online Access:	http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/1/IEMT_2012.pdf

Similar Items

Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models
by: Shaffiar, Norhashimah, et al.
Published: (2012)

Damage progression in BGA solder joints during board-level drop test
by: Yamin, A.F.M., et al.
Published: (2011)

Continuum damage evolution in pb-free solder joint under shear fatigue loadings
by: Shaffiar, Norhashimah, et al.
Published: (2010)

Solder joint reliability assessment: finite element simulation methodology
by: Tamin, M.N., et al.
Published: (2014)

Damage mechanics model for solder/intermetallics interface fracture process in solder joints
by: Shaffiar, Norhashimah, et al.
Published: (2011)

Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue
by: Tamin, M N, et al.
Published: (2005)

Fatigue fracture process of lead-free solder joints in BGA package
by: Tamin, M.N., et al.
Published: (2012)

Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue
by: Mohd Nasir Tamin,, et al.
Published: (2008)

Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package
by: Shaffiar, Norhashimah, et al.
Published: (2010)

Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
by: Kamarudin, Maslina
Published: (2015)

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies
by: Dele-Afolabi, T.T., et al.
Published: (2023)

Low temperature solder alloys for ultrasonic soldering of glass
by: Mustafa, Yusri, et al.
Published: (2015)

Optimization On Laser Soldering Parameters Onto Lead-Free Solder Joint
by: T. J., Nabila, et al.
Published: (2017)

Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
by: Chung, Chee Key
Published: (2003)

Development of Pb-Free Nanocomposite Solder Alloys
by: Basak, A., et al.
Published: (2018)

Solder joint fatigue in a surface mount assembly subjected to mechanical loading
by: Tamin, M. N., et al.
Published: (2007)

Solder joint fatigue in a surface-mount assembly subjected to mechanical loading
by: Tamin, M. N., et al.
Published: (2005)

Soldering iron practice
by: Shah, Asadullah, et al.
Published: (2011)

Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape
by: Lim, Shaw Fa
Published: (2020)

A review: effect of copper percentage solder alloy after laser soldering
by: Asyraf, Abdullah, et al.
Published: (2023)

Interfacial microstructure growth mechanism of lead-free solder using laser soldering
by: Muhammad Asyraf, Abdullah
Published: (2024)

Atomized Lead Free Solder Alloys For Solder Paste Product For Electronic Application
by: Bakir, Mohammed Luay
Published: (2012)

Soldering Characteristics And Corrosion Behaviour Of Indium Added To SAC305 Solder Alloy
by: Amiruddin, Atikah Zulaikha
Published: (2018)

Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn-5Sb solder composites on Cu substrate
by: T. Temitope, Dele Afolabi, et al.
Published: (2019)

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
by: Abdul Aziz, M. S., et al.
Published: (2014)

Thermomigration induced degradation in solder alloys
by: Basaran, C., et al.
Published: (2008)

Thermomigration in lead-free solder joints
by: Abdul Hamid, M. F, et al.
Published: (2008)

Ultrasonic assisted reflow soldering of lead free solder joint / Tan Ai Ting
by: Tan, Ai Ting
Published: (2017)

Procedure of soldering iron practice
by: Shah, Asadullah, et al.
Published: (2011)

Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
by: Muhammad Asyraf, Abdullah, et al.
Published: (2023)

Study on intermetallic compound formation and growth at the solder joint interface during laser soldering using sn-ag-cu powdered compact solder on copper pad
by: Nabila, Tamar Jaya
Published: (2024)

Materials interaction during soldering and isothermal ageing of Sn-Pb and Sn-Ag-Cu solders on electroless Ni/Au surface finish
by: Tai, Siew Fong
Published: (2003)

Fibre laser soldering operation and its effect onto intermetallic compound at the solder joint: short review
by: Nabila, Tamar Jaya, et al.
Published: (2019)

Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715].
by: Oo, Cheng Ee
Published: (2004)

Development of zinc based alloy for solderability
by: Mustafa, Mohd. Yusry, et al.
Published: (2011)

Microwave hybrid heating as an alternative method for soldering—A brief review
by: N. M., Maliessa, et al.
Published: (2023)

Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
by: Nor Adhila Muhammad,, et al.
Published: (2014)

Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
by: Siti Rabiatull Aisha, Idris, et al.
Published: (2014)

Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
by: Hardinnawirda, Kahar
Published: (2017)

Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process
by: Fauzi, Muhamad Razizy, et al.
Published: (2022)