Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects
The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Per...
| Main Authors: | , , , |
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| Format: | Proceeding Paper |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/1/IEMT_2012.pdf |
| _version_ | 1848781713667260416 |
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| author | Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N. |
| author_facet | Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N. |
| author_sort | Yamin, A.F.M. |
| building | IIUM Repository |
| collection | Online Access |
| description | The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load
reversals. Cyclic degradation of solder/IMC interface
properties, namely penalty stiffness, strengths and critical
energy release rates follows power-law functions of fatigue
cycles. Performance of the extended CZM is examined using
finite element (FE) simulation of a single Sn-4Ag-0.5Cu
(SAC405) solder interconnect specimen. Strain ratedependent
response of the solder is represented by unified inelastic strain equations (Anand’s model) with optimized model parameters for SAC405 solders. The 3D FE model of the specimen is subjected to cyclic relative displacement (Δδ
= 0.003 mm, R = 0) so as to induce shear-dominant fatigue
loading. Results show that interface crack initiated at the
leading edge of the solder/IMC interface on the tool side of
the assembly after 22 cycles have elapsed. Bending stress
component induced by the solder stand-off height dominates
the interface damage process. A straight interface crack front is predicted indicating the relatively brittle nature of the SAC405/Cu6Sn5 interface. The extended formulation of the CZM to account for load reversals has demonstrated the
ability to describe the progressive solder/IMC interface
damage process consistent with the mechanics of relatively
brittle interface fracture. |
| first_indexed | 2025-11-14T15:53:56Z |
| format | Proceeding Paper |
| id | iium-39051 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T15:53:56Z |
| publishDate | 2012 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-390512015-01-08T02:28:07Z http://irep.iium.edu.my/39051/ Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N. T Technology (General) The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Performance of the extended CZM is examined using finite element (FE) simulation of a single Sn-4Ag-0.5Cu (SAC405) solder interconnect specimen. Strain ratedependent response of the solder is represented by unified inelastic strain equations (Anand’s model) with optimized model parameters for SAC405 solders. The 3D FE model of the specimen is subjected to cyclic relative displacement (Δδ = 0.003 mm, R = 0) so as to induce shear-dominant fatigue loading. Results show that interface crack initiated at the leading edge of the solder/IMC interface on the tool side of the assembly after 22 cycles have elapsed. Bending stress component induced by the solder stand-off height dominates the interface damage process. A straight interface crack front is predicted indicating the relatively brittle nature of the SAC405/Cu6Sn5 interface. The extended formulation of the CZM to account for load reversals has demonstrated the ability to describe the progressive solder/IMC interface damage process consistent with the mechanics of relatively brittle interface fracture. 2012-11 Proceeding Paper PeerReviewed application/pdf en http://irep.iium.edu.my/39051/1/IEMT_2012.pdf Yamin, A.F.M. and Shaffiar, N.M. and Loh, W.K. and Tamin, M.N. (2012) Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 6th-8th Nov 2012, Ipoh, Perak. http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6521786 |
| spellingShingle | T Technology (General) Yamin, A.F.M. Shaffiar, N.M. Loh, W.K. Tamin, M.N. Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects |
| title | Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects |
| title_full | Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects |
| title_fullStr | Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects |
| title_full_unstemmed | Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects |
| title_short | Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects |
| title_sort | extended cohesive zone model for simulation of solder/imc interface cyclic damage process in pb-free solder interconnects |
| topic | T Technology (General) |
| url | http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/ http://irep.iium.edu.my/39051/1/IEMT_2012.pdf |