$Fatigue fracture process of lead-free solder joints in BGA package$
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Fatigue fracture process of lead-free solder joints in BGA package

Book Description: Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same...

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Bibliographic Details
Main Authors:	Tamin, M.N., Shaffiar, Norhashimah, Z., B. Lai, W., K. Loh
Format:	Book Chapter
Language:	English
Published:	Nova Science Publishers 2012
Subjects:	TA349 Mechanics of engineering. Applied mechanics
Online Access:	http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/1/39020.pdf

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