Fatigue fracture process of lead-free solder joints in BGA package
Book Description: Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same...
| Main Authors: | , , , |
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| Format: | Book Chapter |
| Language: | English |
| Published: |
Nova Science Publishers
2012
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/1/39020.pdf |
| _version_ | 1848781708880510976 |
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| author | Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh |
| author_facet | Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh |
| author_sort | Tamin, M.N. |
| building | IIUM Repository |
| collection | Online Access |
| description | Book Description:
Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same time proposes solutions. The effect of fracture on the structure of nano-catalyst and diamond-like carbon coating de-lamination are some of the microscopical research covered in this book. The format of this book is such that the reader can use each chapter independently. It starts with the first chapter outlining the classical review that traces back to early fracture mechanics. It is then continued to broader ranges from experimental and commercial software implementation, to the formulation and implementation of XFEM and piezoelectricity problems. (Imprint: Nova) |
| first_indexed | 2025-11-14T15:53:52Z |
| format | Book Chapter |
| id | iium-39020 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T15:53:52Z |
| publishDate | 2012 |
| publisher | Nova Science Publishers |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-390202015-05-14T01:47:13Z http://irep.iium.edu.my/39020/ Fatigue fracture process of lead-free solder joints in BGA package Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh TA349 Mechanics of engineering. Applied mechanics Book Description: Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same time proposes solutions. The effect of fracture on the structure of nano-catalyst and diamond-like carbon coating de-lamination are some of the microscopical research covered in this book. The format of this book is such that the reader can use each chapter independently. It starts with the first chapter outlining the classical review that traces back to early fracture mechanics. It is then continued to broader ranges from experimental and commercial software implementation, to the formulation and implementation of XFEM and piezoelectricity problems. (Imprint: Nova) Nova Science Publishers 2012 Book Chapter PeerReviewed application/pdf en http://irep.iium.edu.my/39020/1/39020.pdf Tamin, M.N. and Shaffiar, Norhashimah and Z., B. Lai and W., K. Loh (2012) Fatigue fracture process of lead-free solder joints in BGA package. In: Recent trends in fracture mechanics. Materials Science and Technologies, Mechanical Engineering Theory and Applications . Nova Science Publishers, pp. 247-268. ISBN 978-1-61470-615-1 https://www.novapublishers.com/catalog/product_info.php?products_id=27439 |
| spellingShingle | TA349 Mechanics of engineering. Applied mechanics Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh Fatigue fracture process of lead-free solder joints in BGA package |
| title | Fatigue fracture process of lead-free solder joints in BGA package |
| title_full | Fatigue fracture process of lead-free solder joints in BGA package |
| title_fullStr | Fatigue fracture process of lead-free solder joints in BGA package |
| title_full_unstemmed | Fatigue fracture process of lead-free solder joints in BGA package |
| title_short | Fatigue fracture process of lead-free solder joints in BGA package |
| title_sort | fatigue fracture process of lead-free solder joints in bga package |
| topic | TA349 Mechanics of engineering. Applied mechanics |
| url | http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/1/39020.pdf |